Introduction

• This high conductivity thermal compound is produced particularity for overclockers. It is made of silver material by nanometer production process. It's other various materials are also with much better properties than regular thermal compounds. Spreading small amount thermal compound on chipset surface or heatsink bottom, it enhances heat dissipation performance tremendously.

Features

• Review from DragonSteelMods.com
  

System Requirements

• N/A

Package Contents

• Fan

Supported O.S.

• N/A

Specification

Color Grey Thermal Conductivity > 8.5 W/m .° C Thermal Resistance < 0.205 ° C - in / W Specific Gravity > 2.5 Operation Temperature - 50 ~ 240 ° C Net Weight 3 g